Corning Incorporated will highlight innovations that help network operators stay ahead of demand for high-bandwidth capabilities at the 2019 Optical Networking and Communication Conference & Exhibition (OFC) March 5-7 in San Diego.

The innovations will include a demonstration at Corning’s booth of TXF™ fiber, an ultra-low loss, silica-core fiber with a large effective area, which enables high data-rate transmission over longer spans and extended reach. The demonstration will show how TXF fiber can enable two 200-km subsea backhaul links to support 400 Tb/s transatlantic subsea transmission - creating a seamless end-to-end ITU-T G.654 compliant fiber solution on land and under sea.

In Booth 2822, Corning experts will demonstrate solutions for every segment of the network, from optical fiber, cable, hardware, and equipment to fully-optimized solutions for high-speed communications networks. Corning's innovations focus on helping operators deliver on the promise of emerging applications, with solutions that accelerate deployment, enhance network performance, and minimize total cost of ownership.

"Our industry has arrived at a pivotal moment where an optical fabric is becoming the foundation enabler for true 5G in access networks, as well as high-performance applications like augmented reality and artificial intelligence in hyperscale data centers," said Claudio Mazzali, senior vice president of technology, Corning Optical Communications. "Corning works with its customers - no matter where they are in their network evolution - to help them unlock the opportunities presented by these emerging technologies."

Visitors to Corning's booth also can see:

  • A demonstration of live 400G traffic over Corning's ClearCurve® multimode fiber and SMF-28® Ultra fiber using Corning's award-winning EDGE8(TM) solution for data centers. The demonstration will show how the EDGE8 solution provides a simple migration path to transmission speeds up to 400G and beyond - helping data center operators stay ahead of requirements for emerging technologies such as artificial intelligence.
  • Innovations in Corning's cable product line, including smaller, denser designs that enable faster, easier installation. Corning's RocketRibbon(TM) extreme-density cable is among the finalists being recognized in the Lightwave Innovation Reviews during the conference.
  • A total infrastructure solution for local area network, cellular, and building system networks that offers unparalleled scalability and flexibility now and for future demands. This fiber-deep solution combines the high bandwidth of a fiber infrastructure, the safety of low-voltage remote powering, and the flexibility of a software defined LAN.
  • Innovations added to Corning's portfolio through its 2018 acquisition of the Communication Markets Division of 3M. These include the Clear Track Hallway Fiber Pathway, a surface-mounted, clear adhesive-backed solution that enables fast and easy fiber optic installation with minimal disruption for tenants in multi-dwelling units. Clear Track is another Lightwave Innovation Reviews finalist.

In one of its newest innovations, Corning will highlight an adiabatic glass coupling capability, a low-loss coupling solution for next-generation integrated photonic connectivity. This fiber-to-the-chip solution provides the lowest insertion loss over wide bandwidths compared with other coupling alternatives - making it ideally suited for 400G pluggable transceivers as well as potential future optical co-packaging designs. Visitors to the Corning booth can see results of insertion loss testing conducted by optical transceiver provider Finisar.

"Low insertion loss over wide bandwidths has been a challenge for dense-optical to silicon-photonic connectivity," said Daniel Mahgerefteh, director of advanced technology at Finisar. "Adiabatic glass coupling is a novel solution to provide reliably high performance multi-fiber connectivity compatible with next-generation chip designs. This demonstration is an important milestone for the future of optical transceivers and the role that silicon photonics will play."